ISPhO 2024, Теория — Задача 1. T1. Thermal oxidation

ISPhO, July, 2024 — T1. Thermal oxidation

Условие

Thermal oxidation is the process of creating a very thin (tens/hundreds of nanometres) film of silicon dioxide SiO2\mathrm{SiO_2} on the surface of silicon Si at high temperatures. This technology is an essential part of the manufacturing process of integrated circuits and MOSFETs (metal-oxide-semiconductor), which form the basis of modern electronics. If you place silicon Si in an aerobic environment, the oxidation process of Si+O2→SiO2\mathrm{Si} + \mathrm{O_2} \to \mathrm{SiO_2} will begin. For the description of crystalline silicon and flat oxide films of sufficient thickness (starting from ten nanometres), the Dill-Grove model (1965) does well, but a detailed description of the growth mechanism in other conditions is still an unsolved scientific problem.

Silicon is opaque to visible light, while its dioxide is transparent. These optical properties, combined with the fact that the dioxide film has a thickness of tens of nanometres, create ideal conditions for very precise optical control of the thickness of the SiO2\mathrm{SiO_2} layer.

Photograph of three rows of small oxidized silicon squares on tape, each labelled by hand with the oxidation time from 5m to 150; the colours change from grey through purple, blue, yellow, pink and green.
The change in the visible color of the silicon substrate at different oxidation times. ”Growing Colorful Oxide Layers on Silicon” by ProjectsInFlight on YouTube.

We will investigate the film growth by using ellipsometry, a powerful technique for studying the optical properties of thin films. It is based on a comparison of the amplitude coefficients of reflection of ss-polarized and pp-polarized waves (from the German ”senkrecht” – perpendicular, ”parallel” – parallel) from the surface of the film. The measurement results are represented by ellipsometric angles Ψ\Psi, Δ\Delta:

rprs=tan⁡Ψ⋅eiΔ,\frac{r_p}{r_s} = \tan\Psi \cdot e^{i\Delta},

where the value of Ψ\Psi corresponds to the ratio of amplitudes upon reflection of pp- and ss-polarized waves, and the value of Δ\Delta corresponds to the phase difference between them.

Ellipsometry measures precisely the relative difference between waves (ratio of amplitudes and phase difference) with different polarizations, so it is very resistant to various fluctuations in the power of the radiation source and the sensitivity of the receiver. Ellipsometry also makes it possible to measure the characteristics of a sample without direct mechanical contact with it, which allows measurements to be carried out in real time and in situ (from lat. – ”on the spot”, directly).

During the entire task, the wavelength of the incident wave is marked as λ\lambda. In the optical range, substances do not have significant magnetic qualities, therefore, all materials under consideration have μ=1\mu = 1.

Two stacked plots against lambda, nm from 400 to 800: the upper one Psi, deg (about 30 to 80, sharp peak near 460 nm), the lower one Delta, deg (from -60 to 60, dip near 455 nm then a jump and slow decrease); data points and fit curve with a legend data/fit.
Example of an ellipsometric spectrum Ψ,Δ\Psi, \Delta
Scheme: a light source on the left sends a ray at angle Phi to the normal onto a sample on a hatched base; the reflected ray goes to a photodetector on the right. Labels: Light source, Photodetector, Sample, Φ.
Optical scheme of the ellipsometer: a light source, a Photodetector, and a test sample.

Attention! Place the files you want to attach to the report in the “report” folder.

Attention! It is enough to make only A7 to moving on to part B.

Part A. Theoretical principles of ellipsometry

Maxwell’s equations in a non-magnetic dielectric have the form

div⁡D⃗=0rot⁡E⃗=−∂B⃗∂t\operatorname{div}\vec{D} = 0 \qquad \operatorname{rot}\vec{E} = -\frac{\partial\vec{B}}{\partial t}
div⁡B⃗=0rot⁡B⃗=μ0∂D⃗∂t\operatorname{div}\vec{B} = 0 \qquad \operatorname{rot}\vec{B} = \mu_0\frac{\partial\vec{D}}{\partial t}

For a dielectric:

D⃗=ε0εE⃗\vec{D} = \varepsilon_0\varepsilon\vec{E}

It follows from these equations that the normal components of the vectors D⃗\vec{D} and B⃗\vec{B} as well as the components of the vectors E⃗\vec{E} and B⃗\vec{B} directed along the surface do not change at the dielectric-dielectric boundary.

In a plane wave the wave vector, the electric field vector and the magnetic field vector k⃗\vec{k}, E⃗\vec{E} and B⃗\vec{B} are pairwise perpendicular and right-handed orientated. Also hold the following relations:

B⃗=1ω[k⃗×E⃗],∣k⃗∣=εω/c\vec{B} = \frac{1}{\omega}[\vec{k} \times \vec{E}], \qquad |\vec{k}| = \sqrt{\varepsilon}\omega/c

where ω\omega is the frequency of the wave. The speed of light c=1/ε0μ0c = 1/\sqrt{\varepsilon_0\mu_0}. As a part of this task, we will consider the interaction of a plane wave with layered structures and develop a general approach for the theoretical description of such a system. Let a film with a thickness dd be made of a material with dielectric permittivity ε2\varepsilon_2 be located between two semi-infinite dielectrics with dielectric permittivity ε1\varepsilon_1 and ε3\varepsilon_3 respectively.

When a incident wave falls on the film, a reflected wave occurs in the medium ε1\varepsilon_1, a passing wave in the medium ε3\varepsilon_3 and a superposition of waves going in different directions in the medium ε2\varepsilon_2. In ss-polarization, the direction of the electric field is fixed, so we can proceed to consider scalar complex amplitudes:

{E~1=Eeik1xx+ik1yy+r⋅Ee−ik1xx+ik1yyE~2=a⋅Eeik2xx+ik2yy+b⋅Ee−ik2xx+ik2yyE~3=t⋅Eeik3x(x−d)+ik3yy\begin{cases} \tilde{E}_1 = \mathcal{E}e^{ik_{1x}x + ik_{1y}y} + r \cdot \mathcal{E}e^{-ik_{1x}x + ik_{1y}y} \\ \tilde{E}_2 = a \cdot \mathcal{E}e^{ik_{2x}x + ik_{2y}y} + b \cdot \mathcal{E}e^{-ik_{2x}x + ik_{2y}y} \\ \tilde{E}_3 = t \cdot \mathcal{E}e^{ik_{3x}(x-d) + ik_{3y}y} \end{cases}

In pp-polarization, the direction of the magnetic field is fixed, so it is easier to proceed to the consideration of scalar complex amplitudes of the magnetic field:

{B~1=Beik1xx+ik1yy+r⋅Be−ik1xx+ik1yyB~2=a⋅Beik2xx+ik2yy+b⋅Be−ik2xx+ik2yyB~3=t⋅Beik3x(x−d)+ik3yy\begin{cases} \tilde{B}_1 = \mathcal{B}e^{ik_{1x}x + ik_{1y}y} + r \cdot \mathcal{B}e^{-ik_{1x}x + ik_{1y}y} \\ \tilde{B}_2 = a \cdot \mathcal{B}e^{ik_{2x}x + ik_{2y}y} + b \cdot \mathcal{B}e^{-ik_{2x}x + ik_{2y}y} \\ \tilde{B}_3 = t \cdot \mathcal{B}e^{ik_{3x}(x-d) + ik_{3y}y} \end{cases}
Two side-by-side diagrams (s-polarization: and p-polarization:) of a wave incident at angle θ1 from medium ε1 onto a film ε2 over a substrate ε3; wave vector k in red, the field perpendicular to the plane drawn as a circled dot (E for s, B for p) and the other field in blue (B for s, E for p); axes y to the right and x downward from the origin (0,0).
The incidence of the ss-polarized and pp-polarized wave on the film

A1 Show that k1y=k2y=k3yk_{1y} = k_{2y} = k_{3y}.

A2 Find expressions for k1xk_{1x}, k2xk_{2x} and k3xk_{3x} in terms of ω\omega, cc, θ1\theta_1, ε1\varepsilon_1, ε2\varepsilon_2, ε3\varepsilon_3.

A3 For a wave with ss-polarization (the electric field is directed along the surface), from the boundary conditions for the tangential components of the fields, obtain a system of linear equations for the coefficients rr, AA, bb and tt.

A4 Find the reflection coefficient. Bring the answer to the form:

rs=A+Be2ik2xdAB+e2ik2xd.r_s = \frac{A + Be^{2ik_{2x}d}}{AB + e^{2ik_{2x}d}}.

Express the real numbers AA, BB in terms of k1xk_{1x}, k2xk_{2x} and k3xk_{3x}.

For convenience, use the variables κix=kixεi\kappa_{ix} = \dfrac{k_{ix}}{\varepsilon_i} for i∈[1,3]i \in [1, 3].

A5 For a wave with pp-polarization (the magnetic field is directed along the surface), from the boundary conditions for the tangential components of the fields, obtain a system of linear equations for the coefficients rr, AA, bb and tt.

A6 Find the reflection coefficient. Bring the answer to the form:

rp=A+Be2ik2xdAB+e2ik2xd.r_p = \frac{A + Be^{2ik_{2x}d}}{AB + e^{2ik_{2x}d}}.

Express the real numbers AA, BB in terms of k1xk_{1x}, k2xk_{2x} and k3xk_{3x}.

We will perform preliminary calculations of the approximate shape of the ellipsometric spectrum of a thin layer of silicon dioxide on a silicon substrate. Until the end of Part A, we will neglect the optical dispersion, and assume εAir=1.00\varepsilon_{\mathrm{Air}} = 1.00, εSi=17.2−0.430i\varepsilon_{\mathrm{Si}} = 17.2 - 0.430i, εSiO2=2.13\varepsilon_{\mathrm{SiO_2}} = 2.13. Note that silicon has an imaginary part of the dielectric constant responsible for absorption, due to which it is opaque. The use of complex permittivity does not change obtained expressions, if the trigonometric functions of the complex parameter are considered.

With the help of the A.py program, you can plot Ψ\Psi and Δ\Delta for different angles of incidence θ1\theta_1 and thicknesses dd. At the input, the program receives the name Name of the series, the angle of incidence θ1\theta_1 from the air (in degrees) and the thickness dd of the dioxide film in the form of a table written in the file A_in.txt .

There is an example of filling in a table in a file A_in.txt:

Nameθ1,∘\theta_1,^{\circ}d, nmd,\ \mathrm{nm}
ex15040
ex230100
⋮⋮⋮

The input data is limited to 20∘≤θ1≤80∘20^{\circ} \le \theta_1 \le 80^{\circ}, d≤250d \le 250 nm. The name of the experiment should not contain spaces and tabs. The separator between the integer and fractional parts of numbers is a dot. The separator between the columns is a tab.

A7 Using the program A.py plot the dependence of Ψ\Psi and Δ\Delta on λ\lambda at different angles of incidence θ1\theta_1 and thicknesses dd. Conduct a quantitative study and determine at which angle of incidence θopt\theta_{\mathrm{opt}} the ellipsometric angle Ψ\Psi is most sensitive (the highest value ∣ΔΨ/Δd∣|\Delta\Psi/\Delta d|) to changes in dd in the range from 10 nm10\,\mathrm{nm} to 50 nm50\,\mathrm{nm}. Find the value of θopt\theta_{\mathrm{opt}} with an accuracy of one degree.
Since B3, use θopt\theta_{opt} as Φ\Phi to increase accuracy.

Part B. Kinetics of oxidation

In this part, the angle of incidence of the beam on the film will be indicated by Φ\Phi.

Together with a colleague, you are studying the deposition of thin oxide films on the surface of silicon during prolonged calcination in the dry air. Real silicon Si and silicon dioxide SiO2\mathrm{SiO_2} have optical dispersion, so the graphs Ψ,Δ\Psi, \Delta from λ\lambda that will be offered to you in this part may slightly differ from those that you built in the part A7.

Attention! The optical dispersion of Si and SiO2\mathrm{SiO_2} is automatically embedded in all programs that you will work with in this part.

Your colleague was working late on the ellipsometer yesterday and forgot to write down the value of the angle Φ\Phi. He measured the thickness of the oxide film on two samples and transmitted the measurement results to you in files B1.txt and B2.txt.

Oxygen concentration profile C(x): constant C* far in the air, dropping smoothly to C0 at the air–SiO2 boundary (x = 0), decreasing linearly to Ci across the SiO2 layer, then zero in Si. Below the graph the layers Air, SiO2 (light grey) and Si (dark grey).
Three snapshots of a small red atom moving between grey lattice atoms (left position, squeezed between two atoms in the middle, right position), with arrows to a red potential-energy curve U versus Shift: minima at the sides and a maximum in the middle; the barrier height is marked ΔEa.
A qualitative diffusion scheme in a solid and the meaning of energy ΔEa\Delta E_a.

B1 Using the program B1.py find by hand the value Φ\Phi and the thickness dd of SiO2\mathrm{SiO_2} film. The program B1.py reads values from a file B1.txt automatically and outputs an approximating graph Ψ,Δ\Psi, \Delta from λ\lambda, for the values of the angle Φ\Phi entered by you in degrees and the thickness dd of the dioxide film in nanometers. The input data is limited: 20∘≤Φ≤80∘20^{\circ} \le \Phi \le 80^{\circ}, d≤250d \le 250 nm.

B2 Using the program B2.py find by hand the value Φ\Phi and the thickness dd of SiO2\mathrm{SiO_2} film. The program works similarly to the previous B1.

For a detailed study of the oxidation rate, you can get ellipsometric data from your colleague, measured from a real-time oxidizing silicon substrate. At the initial moment t=0t = 0, he puts pure silicon inside the furniture with a temperature TT, and every 2 min mesures the spectrum Ψ,Δ\Psi, \Delta from λ\lambda at a fixed angle Φ\Phi, which you tell him.

In the file B_in.txt you specify the name of the experiment, the angle Φ\Phi in degrees, the temperature TT in degrees Celsius, and the duration of the experiment in minutes in the form of a table:

NameΦ,∘\Phi,^{\circ}T,∘CT,^{\circ}\mathrm{C}t, mint,\ \mathrm{min}
test50100040
⋮⋮⋮⋮

The input data is limited as 20∘≤Φ≤80∘20^{\circ} \le \Phi \le 80^{\circ}, 800 ∘C≤T≤1200 ∘C800\,{}^{\circ}\mathrm{C} \le T \le 1200\,{}^{\circ}\mathrm{C}, t≤200t \le 200 min. The name of the experiment should not contain spaces and tabs. The separator between the integer and fractional parts of a number is a dot. The separator between the columns is a tab. Next, you run the program gen_data.exe which simulates your colleague conducting an experiment in accelerated mode. You can interrupt the execution of this program at any time, and the results of the measurements already performed will be saved on your computer. You can automatically process the measurement data using the program B.py which uses the same file B_in.txt . This program uses the results of the work gen_data.exe, selects the value of dd for each point and calculates the statistical error of this value. Keep in mind that processing may take several minutes. The results of the program B.py are located in the /res folder in the form of tables and graphs d(t)d(t). An example of an automatically generated program B.py tables in the /res folder:

t, mint,\ \mathrm{min}d, nmd,\ \mathrm{nm}Δd, nm\Delta d,\ \mathrm{nm}
217.30.3
⋮⋮⋮

B3 Get the data for the dependence of the film thickness dd of silicon dioxide on the time tt during oxidation at a temperature of t=1000 ∘Ct = 1000\,{}^{\circ}\mathrm{C} for 120 min. Attach the graph obtained by the program B.py to the report.

Now let us consider the theoretical aspects of thermal oxidation. According to the Deal-Grove model, three processes are responsible for the rate of increase in the thickness of the silicon oxide layer:

  1. diffusion of oxygen to the surface SiO2\mathrm{SiO_2};
  2. diffusion of oxygen through the layer SiO2\mathrm{SiO_2};
  3. oxidation reaction Si+O2→SiO2\mathrm{Si} + \mathrm{O_2} \to \mathrm{SiO_2} at the interface SiO2/Si\mathrm{SiO_2/Si}.

Thus, the concentration of oxygen CC (dimension mol/m3\mathrm{mol/m^3}) changes as it moves deeper into the sample. In the air, far away from the substrate, the oxygen concentration is C∗C^*; inside the silicon dioxide layer, the concentration decreases linearly from C0C_0 to CiC_i; inside silicon, the oxygen concentration is zero.

Let us consider a model for describing these processes. Specific (i.e. per unit surface area) the flow rates of each of the three processes F1F_1, F2F_2, F3F_3 (units of measurement — mole/(c⋅m2)\mathrm{mole/(c \cdot m^2)}) we define as follows:

  1. The diffusion rate is F1=h(C∗−C0)F_1 = h(C^* - C_0), where hh is a certain coefficient characterizing diffusion in the gas phase.
  2. Counting the diffusion rate F2=Dd(C0−Ci)F_2 = \frac{D}{d}(C_0 - C_i), where DD is the diffusion coefficient of oxygen in the dioxide, depending on the temperature TT, and dd is the thickness of the silicon dioxide film.
  3. The rate of the oxidation reaction F3=kCiF_3 = kC_i, where kk is the constant of the rate of the oxidation reaction, depending on the temperature TT.

B4 Express the growing velocity vv of film thickness change in terms of the oxidation reaction rate F3F_3, the molar mass μSiO2\mu_{\mathrm{SiO_2}} and the density ρSiO2\rho_{\mathrm{SiO_2}} of silicon dioxide. Assume that the air-dioxide boundary does not move.

B5 Assuming the problem to be quasi-stationary (the establishment times of all processes are much less than the film rise time), express C0C_0 and CiC_i in terms of C∗C^*, the velocity constants hh, kk, DD and the film thickness dd.

B6 Get the differential equation for the thickness dd of the dioxide film and get its solution with the initial condition d(t0)=d0d(t_0) = d_0 in the form

d2+Ad=B(t+τ),d^2 + Ad = B(t + \tau),

where τ\tau contains information about the initial conditions, and the constants AA and BB are related to the kinetics of oxidation. Express AA and BB in terms of hh, kk, DD, C∗C^*, μSiO2\mu_{\mathrm{SiO_2}} and ρSiO2\rho_{\mathrm{SiO_2}}.

Experiments show that blowing with air (changing the profile C(x)C(x) above the surface), doesn’t change the rate of the process. Therefore we will consider h≫kh \gg k.

At the beginning of the oxidation process, the stationary model is not applicable, so it is used starting from the minimum thickness d0=25d_0 = 25 nm. Enter into the program B7.py the data from the file B_in.txt and get the parameters BB and B/AB/A automatically. If the maximum film thickness obtained in the experiment is less than d0d_0, then the program B7.py outputs ”Final layer is too thin to approximate”.

If the program returns the error ”FileNotFoundError”, run the files gen_data.exe and B.py sequentially with the input data you need, previously entered in the B_in.txt.

B7 Get the values of the parameters BB and B/AB/A for five different temperatures TT. Save the results into a file B8_in.txt in the form of a table.

T,∘CT,^{\circ}\mathrm{C}B, nm2/minB,\ \mathrm{nm^2/min}ΔB, nm2/min\Delta B,\ \mathrm{nm^2/min}B/A, nm/minB/A,\ \mathrm{nm/min}Δ(B/A), nm/min\Delta(B/A),\ \mathrm{nm/min}
100017441.210.02
⋮⋮⋮⋮⋮

The dependence of the reaction rate constant kk on temperature TT is associated with the energy ΔEb\Delta E_b of breaking the bond Si−Si\mathrm{Si - Si} in a silicon crystal, and then the relation between them:

k∝e−ΔEb/kBT.k \propto e^{-\Delta E_b/k_B T}.

The diffusion coefficient in solids is also related to temperature via the so-called activation energy ΔEa\Delta E_a, and the quantitative dependence has the form:

D∝e−ΔEa/kBTD \propto e^{-\Delta E_a/k_B T}

Using the program B8.py you can plot graphs ln⁡(B⋅min/nm2)\ln(B \cdot \mathrm{min/nm^2}) from 1/T1/T and ln⁡(B/A⋅min/nm)\ln(B/A \cdot \mathrm{min/nm})from 1/T1/T and determine the parameters of the automatically drawn lines.

Boltzmann constant kB=1.38⋅10−23k_B = 1.38 \cdot 10^{-23} J/C, elementary charge e=1.60⋅10−19e = 1.60 \cdot 10^{-19} C.

B8 Determine the values of ΔEb\Delta E_b and ΔEa\Delta E_a in electron volts. Attach the linearized graphs to the report.

Отговори

Решение


Оригинал в Архива: T1.pdf · официални решения: T1_sol.pdf